Take a look at Telink Semiconductor’s 2026 CES showcase, following a year of steady sales growth driven by strong market demand. Highlighting the TL322X SoC—a dual-core, low-power chip for next-gen 8K wireless gaming—the company delivers ultra-low latency and versatile connectivity for gaming peripherals like keyboards and mice. Visitors can explore five key demos: Edge AI noise reduction, low-power 8K wireless gaming, 1-to-4 Bluetooth® Channel Sounding, Auracast™ synchronized audio, and “always listening” smart remotes. Telink’s exhibits also span communication, smart home, entertainment, and collaborative devices. We’ll touch on Telink’s wireless gaming strategy—focused on user experience, connectivity, and low latency—with existing mass-produced solutions and plans to expand multi-device support. Additionally, discover its TL-EdgeAI platform, which features the mass-produced TL721X chip for smart audio, with future expansion into wearables and industrial sensing. Discover why Telink invests in wireless gaming—aligning its core strengths with a growing market—and how its innovations shape gaming and smart device tech.